Copper clad dedicated flame retardant

Catalog	ACMA00066980
Description	When applied in the copper clad laminate (CCL) industry, this product can achieve the best dispersity and fire-retarding effect in epoxy resin and phenolic resin. It would be best for the filler quantity to be 20% - 30% generally, and the maximum quantity is not beyond 40%.
Advantage	Higher thermal resistance, being decomposed at 340°C to satisfy the high-temperature (280°C soldering tin temperature) processing requirement; The hardness of the finished product reduces markedly in processing and this is advantageous to the subsequent processing procedures like drilling, etc., with a less equipment loss. The product subject to activated treatment is stable in a resin system, which is excellent in dispersity and free from agglomeration. Excellent cost performance with a price being only half of the ATH of the same specification, resulting in substantial cost reduction.
Loss On Ignition	≥30%
Mg(OH)₂	≥90%
Moisture Content	≤0.5%
Packaging	Can be packaged according to customer requirements
Particle Size	≤10 µm; ≤4.5 µm; ≤3 µm
Whiteness	≥92%

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