Copper, powder, <425 μm

Inquiry
CAS 7440-50-8
Structure Copper, powder, <425 μm
Molecular Weight 63.55
Molecular Formula Cu
Canonical SMILES [Cu]
InChI 1S/Cu
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Boiling Point 2567 °C (lit.)
Melting Point 1083.4 °C (lit.)
Purity 99.5% trace metals basis
Density 8.94 g/mL at 25 °C (lit.)
Appearance powder
Packaging 25, 500 g
Particle Size <425 μm

If the product of interest is not available in our catalog, please contact us to see if there is any relevant stock or other purchase channels.