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Flame Retardant
- Halogen Flame Retardant
- Phosphorus Flame Retardant
- Nitrogen Flame Retardant
- Silicon Flame Retardant
- Aluminum-Magnesium Flame Retardant
- Antimony Flame Retardant
- Boron Flame Retardant
- Expandable Graphite
- MOF Flame Retardant
- Nano Flame Retardant
- Hyperbranched Polymer Flame Retardant
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Functional Flame Retardant
- Composite Flame Retardant for PA
- Composite Flame Retardant for PP
- Composite Flame Retardant for PBT
- Composite Flame Retardant for PVC
- Composite Flame Retardant for PU
- Composite Flame Retardant for Silicone Rubber
- Composite Flame Retardant for Epoxy Resin
- Composite Flame Retardant for TPU
- Composite Flame Retardant for TPE
- Cotton Durable Flame Retardant
- Polyester Durable Flame Retardant
- Semi-durable Flame Retardant
- Non-durable Flame Retardant
- Others
- Smoke Suppressant
- Flame Retardant Polymer
- Flame Retardant Masterbatch
DOPO-HQ
Inquiry| CAS | 99208-50-1 |
| Structure |  |
| Synonyms | 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, Flame retardant DOPO-HQ (HCA-HQ) |
| Molecular Weight | 324.27 |
| Molecular Formula | C18H13O4P |
| Boiling Point | 592.9±60.0 °C |
| Melting Point | 245-255 °C |
| Purity | 99% min |
| Density | 1.49±0.1 g/cm³(Predicted) |
| Appearance | White powder |
| Application | In epoxy resin, It can be widely used in the flame retardant of the polymermaterials of the sealed, potting of the electronic components. It is widely used in semiconductor material encapsulation, printed substrate,and other fields. |
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