Electronics Grade Flame Retardant

Density	2.3g/cm³
Solubility	Not dissolve in water and ordinary solvent
Appearance	White find-grained powder
Application	High temperature polyamides and polyamide compounds Glass-fiber-reinforced and unreinforced grades. Various kind of thermoplastic and thermosetting type resins Epoxy resin electronics potting compounds Epoxy-based printed circuit board (PCB) Flexible flame retard copper clad laminate (FR-FCCL)and flame retard copper clad laminate (FR-CCL) Various kinds of high end Electrical and Electronic (E&E) Equipment applications. Thermoplastic and thermosetting type resins and elastomer such as PET, PBT, PP, TPU, Nylon, SEBS and so on. Tag, sealant, coating adhesive etc.
Storage	To save in the area of both dry and closing To avoid the direct exposure of the sunshine
Content	Phosphorus content(w/w) min.23%
Decomposition Temperature	min.300°C
Feature	With a premium flame retarding performance With outstanding anti-hydrolysis capability Does not dissolve in water and ordinary solvent Excellent high temperature heat and pyrolysis resistanceNo migration and well compatibility Electrical, mechanical and integrated physical properties Involving high efficient active phosphorus with great dispersion in a wide range of resin and organic solvent systems Improve comprehensive physical properties of polymer materials and the flame retard ability of finished products.
Moisture Content	0.001
Packaging	25 kg/ bag
pH	5-7
Volatiles	max.0.5%

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