Copper, nanopowder, 25 nm

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CAS 7440-50-8
Structure Copper, nanopowder, 25 nm
Molecular Weight 63.55
Molecular Formula Cu
Canonical SMILES [Cu]
InChI 1S/Cu
InChI Key RYGMFSIKBFXOCR-UHFFFAOYSA-N
Boiling Point 2567 °C (lit.)
Melting Point 1083.4 °C (lit.)
Density 8.94 g/mL at 25 °C (lit.)
Appearance nanopowder
Packaging 5g
Particle Size 25 nm (TEM)

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