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Flame Retardant
- Halogen Flame Retardant
- Phosphorus Flame Retardant
- Nitrogen Flame Retardant
- Silicon Flame Retardant
- Aluminum-Magnesium Flame Retardant
- Antimony Flame Retardant
- Boron Flame Retardant
- Expandable Graphite
- MOF Flame Retardant
- Nano Flame Retardant
- Hyperbranched Polymer Flame Retardant
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Functional Flame Retardant
- Composite Flame Retardant for PA
- Composite Flame Retardant for PP
- Composite Flame Retardant for PBT
- Composite Flame Retardant for PVC
- Composite Flame Retardant for PU
- Composite Flame Retardant for Silicone Rubber
- Composite Flame Retardant for Epoxy Resin
- Composite Flame Retardant for TPU
- Composite Flame Retardant for TPE
- Cotton Durable Flame Retardant
- Polyester Durable Flame Retardant
- Semi-durable Flame Retardant
- Non-durable Flame Retardant
- Others
- Smoke Suppressant
- Flame Retardant Polymer
- Flame Retardant Masterbatch
HPCTP
Inquiry| CAS | 1184-10-7 |
| Structure |  |
| Synonyms | Hexaphenoxycyclotriphosphazene；HPCTP；Phenoxycyclotriphosphazene; PCPZ |
| Molecular Formula | C36H30N3O6P3 |
| Melting Point | 104-115℃ |
| Appearance | Earthy white ~ light yellow powder |
| Application | Can be used in electronic grade flame retardant for epoxy related products Fireproof for LED embedding material application EMC: Epoxy Molding Compound flame retard EPOXY and SILICON Electronic plate material/ flame retard grade CCL/ flame retard grade PCB Powder coating Embedding material High molecular material Versatile high value application |
| Storage | Avoid fire and heat; Stored in cool and vent place |
| Content | phosphorus ≧ 13%; nitrogen ≧ 6% |
| Decomposition Temperature | ≧ 330℃ |
| Packaging | 25 KG/bag |
| Volatiles | ≦ 0.5% |
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